The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Today, designers of compact electronic systems are faced with board space constraints, thus driving the requirement for alternative packaging technologies. Functional integration and miniaturization is the key to success!
To aid this miniaturization campaign, a new generation of Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal diodes are lead-free with Cu/Ni/Au plated terminations and are compatible with lead-free manufacturing processes, conforming many industry and government regulations on lead-free components.
Bourns offers MITE Schottky Barrier Diodes for rectification applications in compact chip package DO-216AA size format. The Model CD216A-B1 Schottky Rectifier Diode Series offer a forward current of 1 A with a choice of repetitive peak reverse voltage of 20 V up to 40 V.
Bourns® Chip Diodes conform to JEDEC standards, easy to handle on standard pick and place equipment and their flat configuration makes roll away much more difficult.