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Microelectronic Modules
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  Skip Navigation LinksProducts    Microelectronic Modules
 
 
Microelectronic Modules

 
 
Bourns demonstrated expertise in technology integration, assembly processes, packaging technology and product launch control results in faster time to market. Knowledgeable Bourns engineers provide a valuable, cost-effective resource across multiple environments and a broad range of applications that ensure enhanced functionality and compatibility from the design stage through manufacturing.

Bourns’ Packaging Solutions
Whether it’s a quick-turn prototype or high-volume manufacturing design, Bourns delivers:
  • Design compatibility
  • Miniaturization
  • RF performance
  • Precision assembly
  • High reliability
  • Cost-effective design
  • Thermal management
  • Environmental protection
 Core benefits:
  • Seamless transfer from product design and prototype to volume production
  • DFM and DFT guidance during new product development
  • In-house thick film hybrid manufacture and assembly
  • Experienced packaging that meets harsh electrical and mechanical environments
Read about Bourns' Custom Packaging Solutions

 
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 Bourns offers Design Kits that include several of these product lines
 Call your local Bourns representative or contact us direct for assistance