|
|
 
| |
 |
 Technologies
One of Bourns key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customer's applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts. For more information, email techweb@bourns.com.
- Surface Mount Packaging:
package outline with leads that attach to the printed circuit board via solder pads
- Thick Film on FR4:
a resistive element screen-printed and cured on an FR4 board
- Thick Film on Plastic:
a resistive element screen-printed and cured onto a plastic substrate
- Cermet Thick Film:
a multifunctional (resistive, conductive, or insulative) combination of precious metals and an organic binder milled under pressure to form a printable ink
- Polymeric Thick Film:
a combination of highly conductive carbon black and a non-conductive crystalline polymer
- Thick Film Thermistors:
a thick film device with a fixed and precisely specified temperature coefficient
- Thick Film Piezoresistors:
a thick film device that produces resistance under pressure changes
- Thin Film on Silicon:
a very thin metallic film vapor deposited on a silicon
- Thin Film Resistors:
a resistor element made by vapor-deposition of a very thin metallic film onto a ceramic substrate
- Silicon Integrated Circuits:
a single chip with specific dopants diffused into an active substrate material to create the functions of circuit components such as resistors, capacitors, diodes, and transistors.
- Wirewound Resistive Elements:
a length of high-resistivity wire wound onto an insulated mandrel to form a resistive element
- Hybritron Resistive Elements:
a wirewound element with a stripe of conductive plastic ink along the wiper track
- Ceramic:
the product of firing a nonmetallic material at high temperature, used in the manufacture of ceramic substrates
- Silicon:
a tetravalent nonmetallic element, used in the manufacture of semiconductors
- Chip Scale Packaging:
advanced wafer level integrated passive devices on a silicon substrate
- Dual Inline Packaging:
package outline with an equal number of leads on each side on the unit
- Pressed Ceramic Substrates:
dry powder pressed ceramic substrates with excellent thermal characteristics
- Single Inline Packaging:
package outline with all leads in-line
- Thick Film on Ceramic:
a resistive element screen-printed and fired onto a ceramic substrate
|
|
|