Search
Languages
 
 
 
 
 
  • •Keyword
  • •Inventory
  • •Cross-Reference
  • •Parametric Search
 

SEMS: Microelectronic Modules

prodline_sems_00

We work in close collaboration with our customers to select the optimal package for an application utilizing the abundance of options, experience and technology from Bourns.

Mineral Source Reporting for SEMS: CFSI_CMRT5-01

Available Packages

  • Single in line
  • Dual in​ line
  • COB interposer
  • BGA
  • System in package
  • Custom

Package Features

  • High-density thick film
  • RF substrate materials
  • Chip & wire
  • Flip chip
  • Stud bump bonding
  • RF packaging
  • Fine pitch SMT

Core Benefits

  • Seamless transfer from product design and prototype to volume production
  • DFM and DFT guidance during new product development
  • In-house thick film hybrid manufacture and assembly
  • Experienced packaging that meets harsh electrical and mechanical environments
Please take a quick survey
Quick survey  
Opt out

Bourns Web Survey

Please answer as many questions as you can with 1 being unfavorable and 5 most favorable.
How easy was it to find what you were looking for on our website?
How satisfied are you with the content?
Did it take you more or less time than you expected to find what you were looking for?
How likely is it that you will recommend our website to a friend or colleague?
(Please include your email address if you have any questions.)