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SEMS: Microelectronic Modules

prodline_sems_00

We work in close collaboration with our customers to select the optimal package for an application utilizing the abundance of options, experience and technology from Bourns.

Mineral Source Reporting for SEMS: CFSI_CMRT5-01

Available Packages

  • Single in line
  • Dual in​ line
  • COB interposer
  • BGA
  • System in package
  • Custom

Package Features

  • High-density thick film
  • RF substrate materials
  • Chip & wire
  • Flip chip
  • Stud bump bonding
  • RF packaging
  • Fine pitch SMT

Core Benefits

  • Seamless transfer from product design and prototype to volume production
  • DFM and DFT guidance during new product development
  • In-house thick film hybrid manufacture and assembly
  • Experienced packaging that meets harsh electrical and mechanical environments

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