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SEMS: Microelectronic Modules

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We work in close collaboration with our customers to select the optimal package for an application utilizing the abundance of options, experience and technology from Bourns.

Mineral Source Reporting for SEMS: CFSI_CMRT5-01

Available Packages

  • Single in line
  • Dual in​ line
  • COB interposer
  • BGA
  • System in package
  • Custom

Package Features

  • High-density thick film
  • RF substrate materials
  • Chip & wire
  • Flip chip
  • Stud bump bonding
  • RF packaging
  • Fine pitch SMT

Core Benefits

  • Seamless transfer from product design and prototype to volume production
  • DFM and DFT guidance during new product development
  • In-house thick film hybrid manufacture and assembly
  • Experienced packaging that meets harsh electrical and mechanical environments
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