金属芯片电阻器和EB焊接分流器

Bourns提供金属芯片电阻器和电子束焊接金属片分流器。

此种高功率电阻因其金属片电阻而具有非常低的电阻值和TCR,适用于所有类型的电流检测应用。

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金属芯片电阻器(CRA、CRE、CRF、CST系列)具有电镀锡(Sn)外部端子,用于焊接到电路板上。电阻元件由环氧树脂涂层保护。

EB焊接金属片分流器(Bourns® CSS系列)采用电子束焊接铜合金电极和铁铬合金或锰铜合金制造的电阻元件,具有出色的电气特性。铜合金电极,可提供额外的机械强度并易于焊接。

 

特点
尺寸 0805 至 2512 金属芯片
2512 至 5931 EB焊接分流器
额定功率70°C 0.5 W 至 15 W
阻力范围 0.2 至 100 毫欧姆
耐受性 ±1 %, ±5 %
温度系数 ±50, 100, ±200 ppm/°C
操作温度范围 –55 至 +170 °C

 

 

Series CRF0805
数据表 CRF0805
产品图片 CRF1206_part
阻值范围 0.003 to 0.020 ohms
允许公差 1 %, 5 %
温度系数 ±50 ppm
单颗电阻功率 0.5 W
相关文件 CRF0805
Engineering
工程檔 Downloads
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