Hochgeschwindigkeitsschutz TBU® (HSPs)

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Spezifikationen

Klicken Sie hier, um mithilfe von TBU® HSP-Produkten realisierte integrierte Lösungen von Bourns anzusehen.

Die TBU® HSP-Vorrichtungen sind in folgenden Produktfamilien vertreten: TBU-CA, TBU-CX, TBU-DT, TBU-KE, TBU-PK, TBU-PL, P40, P-G (P500-G, P850-G), C (C650 und C850) und P-U (P650-U und P850-U).

Obsolete Mit diesem Symbol gekennzeichnete Produkte sind verfügbar, werden jedoch nicht für Neuentwicklungen empfohlen.

Konfliktmineralien- Herkunftsbericht für TBU®, TCS ：CMRT

Kurzbroschüre
		Kurzbroschüre Hochgeschwindigkeitsschutz TBU® von Bourns®

PortNote®-Lösungen
		CAN-Bus – Überspannungsschutz
		HD-SDI/SDI – Koaxialanschluss
		LVDS-Eingabeanschluss – Überspannungsschutz
		LVDS-Ausgabeanschluss – Überspannungsschutz
		SLIC-Schutz RJ11 – ITU-T Negativspannungsüberwachung
		SLIC-Schutz RJ11 – GR-1089-CORE Negativspannungsüberwachung
		Serielle Schnittstelle RS485 – ESD-/EFT-/ Überspannungsschutz
		T1/E1 GR-1089-CORE
		VDSL-Schutz, netzseitig
		VDSL über POTS

Vorführvideos
		Video Hochgeschwindigkeitsschutz TBU®
		Video Auswertungsplatine 1 RS485
		Video Auswertungsplatine 2 RS485

Anwendungsbeschreibungen
		Anwendungsbeschreibung Mobilfunkbasisstation-Schutz
		Umgang mit transienter Gefahr in RS-485-Systemen Anwendungsbeschreibung (PDF, 2,6 MB)
		Überprüfung des Stroms mit Bourns® TBU® Hochgeschwindigkeitsschutz Anwendungsbeschreibung
		Anwendungsbeschreibung VDSL-Leitungstreiber mit TBU®-Hochgeschwindigkeitsschutzlösungen von Bourns®
		Anwendungsbeschreibung Hochgeschwindigkeits-Ethernet-Schutz TBU® GR-1089; Anschlusstyp 2 und 4
		Anwendungsbeschreibung schneller Überspannungsschutz für HF-Anschlüsse in tragbaren Instrumentierung

Design-Kits
		TBU-LAB1 – Design-Kit SLIC-Schutz TBU® HSP
		TBU-LAB2 – Design-Kit Bidirektionale TBU® HSP-Anschlusslösung
		TBU-LAB3 – Design-Kit Unidirektionale TBU® HSP-Anschlusslösung

Konstruktionshinweise
		Auswertungsplatine 1 RS485-Schnittstellensschutz
		Auswertungsplatine 2 RS485-Schnittstellensschutz

Schulung
		Hochgeschwindigkeitsschutz TBU®

Product Series

Parametric Table

RoHS Files

Collateral

Videos

Request Samples

Data Sheet

MDS

Specifications

Design Files

Return to Product Line

TBU-Produkte von Bourns gewinnen den EDN 2008 Innovation Award

Bourns erwirbt innovative Schutzabschaltungstechnologie von Fultec

Bourns und Magnachip geben Start der Massenproduktion von Schutzschaltern mit Schnellabschaltung aus TBU® Serie bekannt

Bourns stellt neue TBU®-Schutzabschaltungsserie vor, die sich durch eine Vielzahl an Auslösestrom- und -spannungswerten auszeichnet

Bourns® Electronic Current Limiters TCS™ & TBU® High-Speed Protectors Short Form

Anwendungsbeschreibung Mobilfunkbasisstation-Schutz

Anwendungsbeschreibung Ethernet-Schutz mit elektronischem Strombegrenzer TBU® GR-1089; Anschlusstyp 2 und 4

Anwendungsbeschreibung VDSL-Leitungstreiber mit TBU®-Hochgeschwindigkeitsschutzlösungen von Bourns®

Überprüfung des Stroms mit Bourns® TBU® Hochgeschwindigkeitsschutz Anwendungsbeschreibung

Anwendungsbeschreibung: Schneller Überspannungsschutz für HF-Anschlüsse in Handinstrumenten

Minimum Trigger Current (mA)	min 50	max 500
Minimum Trigger Current (mA)	Not Specified Check the "Not Specified" box to include products that do not have this particular parameter specified.
Maximum Continuous RMS Voltage (V)	min 28	max 450
Maximum Peak Impulse Voltage (V)	min 250	max 850
Maximum Time to Protected State (μs)	min 0.2	max 1

Typical Resistance (Ω)

min
2.6

max
50

Minimum Voltage for TBU to Return to Normal Status (V)

min
4.5

max
15

Not Specified Check the "Not Specified" box to include products that do not have this particular parameter specified.

Maximum Current Through Triggered TBU (mA)

min
0.5

max
0.7

Design Function
Automotive Compliance

Model/Datasheet	MSL	Lötprofile	Verpackungsetikett	Anschluss	Konf.	Prüfberichte Dritter	MDB	China RoHS
TBU-CA	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-CA	China RoHS2 - TBU
TBU-DB-Q	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-DB-Q	China RoHS2 - TBU
TBU-CA-Q	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-CA	China RoHS2 - TBU
TBU-DF	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-DF	China RoHS2 - TBU
TBU-DT	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-DT	China RoHS2 - TBU
TBU-PL	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-PL	China RoHS2 - TBU
TBU-RS	1	See Data Sheet	Label TBU	e3	TBU1	Request Report	TBU-RS	China RoHS2 - TBU
P40	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-P40	China RoHS2 - TBU
P-G	3	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-Pxxx	China RoHS2 - TBU
C	3	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-Cxxx	China RoHS2 - TBU

File	Type	Size	Uploaded on	Download
Schutz für Hochgeschwindigkeits-Kommunikationsanschlüsse	PDF	843,57 KB	28 Mai, 2015	Download

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