RIVERSIDE, Calif., April 2, 2026 - Bourns today announced the SRP2008DP Series, its new line of high current shielded power inductors designed for high current applications that need to push the limits of board-space efficiency. Constructed with a metal-alloy powder core and packaged in a low-profile 0.8 mm footprint, the SRP2008DP Series delivers the saturation current capacity that power dense DC-DC converter designs demand—without the design layout penalties that typically accompany such performance.
Because power density requirements have continued to climb across consumer electronics, IoT devices and smaller industrial equipment, designers face a persistent tradeoff between inductor performance and physical size. Radiated emissions and signal integrity are growing concerns in these crowded layouts, where interference between adjacent components can undermine system reliability and complicate EMC compliance. Shielded magnetics help manage these risks, but shielded components have historically occupied more board real estate than unshielded alternatives. The SRP2008DP Series’ metal-alloy powder core design and compact size addresses these challenges directly.
“As electronic systems grow more sophisticated while shrinking in size, the components inside them have to keep pace. The Bourns® SRP2008DP Series gives engineers all the safety, signal integrity and compliance benefits of a shielded, high-current inductor in a footprint that doesn’t compromise their layout.”
— Craig Wedley, Magnetic Products Engineering Director at Bourns
Design Features
- Shielded construction contains magnetic flux, reducing radiated emissions that can interfere with adjacent circuitry and supporting board-level EMC compliance efforts
- Metal-alloy powder core offers high resistivity that suppresses eddy currents and reduces core losses at high switching frequencies, preserving signal integrity in noise-sensitive designs
- Contained flux minimizes magnetic coupling to nearby traces and components, reducing the risk of interference in densely populated layouts
- High saturation current supported without core collapse under load, maintained across the full operating range
- 0.8 mm low-profile package fits height-constrained designs where vertical clearance is limited
- Wide operating temperature range from -40 °C to +125 °C for demanding thermal environments
- RoHS compliant* and halogen free**
Electrical Specifications
The SRP2008DP Series covers an inductance range of 0.24 μH to 4.70 μH, heating current (I
rms) from 1.10 A to 3.50 A, and saturation current (I
sat) from 1.60 A to 5.50 A. The 2.0 x 1.6 mm footprint is designed to drop into compact power conversion circuits with minimal routing changes.
|
Series
|
Size (mm)
|
Inductance (μH)
|
Irms (A)
|
Isat (A)
|
| SRP2008DP |
2.0 × 1.6 × 0.8 |
0.24 – 4.70 |
1.10 – 3.50 |
1.60 – 5.50 |
Target Applications
- DC-DC converters in portable and handheld devices
- Miniature consumer electronics and wearables
- IoT modules and compact industrial power circuits
- Height-constrained PCB-based designs requiring shielded magnetics
Availability
The SRP2008DP Series is available now through Bourns’ authorized distribution network. Full specifications and ordering information are available on our website. Samples may be requested through Bourns Customer Service.