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Microelectronic Modules

Bourns demonstrated expertise in technology integration, assembly processes, packaging technology and product launch control results in faster time to market. Knowledgeable Bourns engineers provide a valuable, cost-effective resource across multiple environments and a broad range of applications that ensure enhanced functionality and compatibility from the design stage through manufacturing.

Bourns’ Packaging Solutions

Whether it’s a quick-turn prototype or high-volume manufacturing design, Bourns delivers:

  • Design compatibility
  • Miniaturization
  • RF performance
  • Precision assembly
  • High reliability
  • Cost-effective design
  • Thermal management
  • Environmental protection

Core Benefits

  • Seamless transfer from product design and prototype to volume production
  • DFM and DFT guidance during new product development
  • In-house thick film hybrid manufacture and assembly
  • Experienced packaging that meets harsh electrical and mechanical environments


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