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SEMS: Capabilities

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We offer a broad range of assembly processes and services to meet each customer's need for a packaging solution. Mixed technology assembled with solid process controls is our strength.

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Core Benefits

  • Engineering design, layout, process development and test support
  • PCBA SMD on all substrates
  • Thick film made in-house
  • Chip-on-Board, chip & wire
  • BGA, flip chip, stud bumping
  • Custom lead frames
  • ICT & functional test
  • Coatings and lid seals
  • AOI & X-ray inspection
  • Extensive analytical lab capability
  • Evaluation and environmental testing

Packages Available

  • Single in line
  • Dual in line
  • COB interposer
  • BGA
  • System in package
  • Custom

Features

  • High density thick film
  • RF substrate materials
  • Chip & wire
  • Flip chip
  • Stud bump bonding
  • RF packaging
  • Fine pitch SMT
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