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Diode Arrays

TVS Diode Arrays
Specifications
Summary

The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Today, designers of compact electronic systems are faced with board space constraints, thus driving the requirement for alternative packaging technologies. Functional integration and miniaturization is the key to success!

To aid this miniaturization campaign, a new generation of Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.

Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes rollaway.

Obsolete Products marked with this symbol are currently available, although not recommended for new designs. 

Advantages

The Chip Diode product range provides distinct advantages over some of our competitors, such as:

  • Package Size: The Chip Diodes 0603, 1005, 1206, 1408, 2010 are leadless, allowing designers to make real estate savings on PCB layouts.
  • Environmental: All Bourns® diodes are RoHS compliant and units meet many worldwide industry and government regulations on lead free components.
  • Manufacturing Friendly: Chip Diodes allow the use of industry standard pick & place equipment. The Chip Diode package makes it easy to handle and the flat configuration minimizes rollaway in production operations.

Conflict Mineral Source Reporting for Diodes: CFSI_CMRT4-01

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  Specifications

Series CD143A-SR70 Series
Data Sheet CD143A-SR70 Series
Photo sot143c_part
Type Steering Diode Arrays
Working Peak Reverse Voltage
VRMM (V)
70
Min. Breakdown Voltage
VBR (V)
85
Typical
Capacitance
C (PF)
10
RoHS Compliant CD143A-SR70 Series
Design Files Downloads
Engineering
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  Design Files

Diode (Line) Capacitance – Cd (pF) min
0.18
max
500
Working Reverse Voltage - VRWM (V) min
2.5
max
70
Clamp Voltage (V) min
1.5
max
100
Max Pulse Current @8/20μs - IPP(A) min
1.2
max
95
 Not Specified Check the "Not Specified" box to include products that do not have this particular parameter specified.
Number of Protected Lines
Function
Package
Bi/Uni Directional
AEC-Q101 Compliance
Model/Datasheet Photo MSL Soldering Profiles Packaging Label Terminal CofC 3rd Party Test Reports MDS China RoHS
CD143A-SR05 ~ 12sot143c_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CD143A
CD143A-SR05LCsot143c_part3SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CD143A-SR05LC
CD143A-SR2.8 ~ 3.3sot143c_part3SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CD143A-SR2.8
CD143A-SR3.3
CD143A-SR70sot143c_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CD143A
CDDFN10-0506NCDDFN10-3304N_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDDFN10
CDDFN10-0516PCDDFN10-0516P_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDDFN10-0516P MDS
CDDFN10-0524PCDDFN10-0524P_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
DFN-10 Package
CDDFN10-2574NCDDFN10-2574N_part1SMD (Semiconductor Packages)
Label Diodes2
e4CD 1
Request Report
CDDFN10-2574N
CDDFN10-3304NACDDFN10-3304N_part3SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDDFN10-3304NA
CDDFN10-3324PCDDFN10-0524P_part3SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDDFN10-3324P
CDDFN6-0504PCDDFN6-0504P_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDDFN6-0504P
CDDFN6-3312Pcddfn6_3312p_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDDFN6-3312P
CDMSP10-0504MCDMSP10-0504M_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDMSP10-0504M
CDNBS08-PLC03-6cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-SLVU2.8-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-SLVU2.8-8cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-SMDA05-6 SeriescdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-SRDA SeriescdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-SRDA12-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-SRDA15-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-SRDA3.3-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-T SeriescdnbS08_plc03_6_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS08-T58CCCDNBS08-T58CC_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS08
CDNBS16-T Series2nbs16j_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
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CDNBS16
CDSC706-0504Ccdsot23_part3SMD (Semiconductor Packages)
Label Diodes2
e4CD 1
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CDSC706-0504C
CDSOT23-0502Bcdsot23_t_partSMD (Semiconductor Packages)
Label Diodes2
CD 1
Request Report
CDSOT23
CDSOT23-0502Ucdsot23_t_partSMD (Semiconductor Packages)
Label Diodes2
CD 1
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CDSOT23
CDSOT236-0502cdsot23_partSMD (Semiconductor Packages)
Label Diodes2
CD 1
Request Report
CDSOT236-0502
CDSOT236-0504Ccdsot23_partSMD (Semiconductor Packages)
Label Diodes2
CD 1
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CDSOT236-0504C
CDSOT236-0504LCcdsot23_partSMD (Semiconductor Packages)
Label Diodes2
CD 1
Request Report
CDSOT236-0504LC
CDSOT236-TxxC Seriescdsot23_part3SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT236
CDSOT23-SLVU2.8cdsot23_t_part_nr1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23
CDSOT23-SM712cdsot23_t_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23-SM712 (A)
CDSOT23 (C)
CDSOT23-SR208cdsot23_part1SMD (Semiconductor Packages)
Label Diodes2
e4CD 1
Request Report
CDSOT23-SR208
CDSOT23-SRV05-4cdsot23_part1SMD (Semiconductor Packages)
Label Diodes2
e4CD 1
Request Report
CDSOT23-SRV05-4
CDSOT23-T24CANcdsot23_t_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23-T24CAN (A)
CDSOT23 (C)
CDSOT23-T24CAN-QCDSOT23-T24CAN-Q_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23
CDSOT23-TxxC Seriescdsot23_t_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23-TxxC (A)
CDSOT23 (C)
CDSOT23-TxxC-Q Seriescdsot23_txxlc_q_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23
CDSOT23-TxxLC Seriescdsot23_t_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23-TxxLC (A)
CDSOT23 (C)
CDSOT23-TxxLC-Q Seriescdsot23_txxlc_q_part1SMD (Semiconductor Packages)
Label Diodes2
e3CD 1
Request Report
CDSOT23
CDSOT353-T05CDSC706-0504C_partSMD (Semiconductor Packages)
Label Diodes2
CD 1
Request Report
CDSOT353-T05_MDS
CDSOT563-0502CDSC706-0504C_partSMD (Semiconductor Packages)
Label Diodes2
CD 1
Request Report
CDSOT563-0502
FileTypeSizeUploaded onDownload
Protecting High Speed Communication PortsPDF843.57 KB28 May, 2015 Download
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