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Proven Reliability

  • Dependable performance
  • Superior product quality
  • Proven in critical applications

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Breakthrough Technologies

  • Innovative products
  • Advanced semiconductor expertise
  • R&D focus

 

Bourns' demonstrated expertise in technology integration, assembly processes, packaging technology and product launch control results in faster time to market. Knowledgeable Bourns engineers provide a valuable, cost-effective resource across multiple environments and a broad range of applications that ensure enhanced functionality and compatibility from the design stage through manufacturing.

Core Benefits

  • Seamless transfer from product design and prototype to volume production
  • Design For Manufacturability and Design For Testability guidance during new product development
  • In-house advanced packaging manufacturing capability and assembly
  • Experienced packaging that meets harsh electrical and mechanical environments

 
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Collaboration and Services

  • Uncompromising integrity
  • Strong partnerships
  • Value-added solutions

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Global Support Network

  • Comprehensive local support
  • Global manufacturing
  • Fast-turnaround services

 

Bourns’ Packaging Solutions

Whether it’s a quick-turn prototype or high-volume manufacturing design, Bourns delivers:

  • Design compatibility
  • Miniaturization
  • RF performance
  • Precision assembly
  • High reliability
  • Cost-effective design
  • Thermal management
  • Environmental protection
  • High-precision wafer processing and packaging configuration (e.g., wafer preconditioning)
  • Fully automated high-speed die attachment and placement (at sub-10 micron accuracy)
  • Sophisticated, comprehensive, and versatile wire-bonding capabilities (Au ball, Al wedge, RF-Au wedge, ribbon, Copper, etc.)
  • Complete System-in-Package (SiP) solutions equipped with mixed assembly capabilities (e.g., Multi-chip packaging)
  • High-precision plastic over-molding, chip encapsulation, multiple-layer material dispensing, dam-and-fill processes, etc.
  • Complex multi-die segmentation builds with open-cavity packaging capabilities (housed in Class 1,000 & 10,000 Cleanrooms)
  • Materials-centric advanced IC and multi-chip packaging expertise and process development know-how
  • ISO/TS 16949:2009 Certified (China and Mexico)
  • ISO 14001:2004 Certified (China and Mexico)
  • ISO 9001:2008 Certified (China and Mexico)
  • ITAR Registered (Mexico)
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